SK

Stephen J. Kramer

Micron: 61 patents #273 of 6,345Top 5%
IF Idaho Research Foundation: 2 patents #28 of 128Top 25%
📍 Boise, ID: #155 of 3,546 inventorsTop 5%
🗺 Idaho: #204 of 8,810 inventorsTop 3%
Overall (All Time): #36,341 of 4,157,543Top 1%
62
Patents All Time

Issued Patents All Time

Showing 51–62 of 62 patents

Patent #TitleCo-InventorsDate
6630403 Reduction of surface roughness during chemical mechanical planarization (CMP) Scott Meikle 2003-10-07
6592443 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Michael J. Joslyn 2003-07-15
6568998 Method and apparatus for uniformly planarizing a microelectronic substrate Scott Meikle 2003-05-27
6534507 Methods for treating psychological disorders using bioactive metabolites of gepirone Louis Fabre, Edward H. Ruediger, Joseph P. Yevich 2003-03-18
6492273 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Jim Hofmann, Gundu M. Sabde, Scott E. Moore 2002-12-10
6472325 Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Jim Hofmann, Gundu M. Sabde, Scott E. Moore 2002-10-29
6468912 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Jim Hofmann, Gundu M. Sabde, Scott E. Moore 2002-10-22
6464824 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies James J. Hofmann, Gundu M. Sabde, Michael J. Joslyn 2002-10-15
6461964 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Jim Hofmann, Gundu M. Sabde, Scott E. Moore 2002-10-08
6450863 Method and apparatus for uniformly planarizing a microelectronic substrate Scott Meikle 2002-09-17
6426295 Reduction of surface roughness during chemical mechanical planarization(CMP) Scott Meikle 2002-07-30
6176763 Method and apparatus for uniformly planarizing a microelectronic substrate Scott Meikle 2001-01-23