Issued Patents All Time
Showing 26–50 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7037829 | Compound structure for reduced contact resistance | Yongjun Jeff Hu, Luan C. Tran, Brent Gilgen | 2006-05-02 |
| 7038318 | Compound structure for reduced contact resistance | Yongjun Jeff Hu, Luan C. Tran, Brent Gilgen | 2006-05-02 |
| 6977225 | Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants | Sujit Sharan | 2005-12-20 |
| 6952051 | Interlevel dielectric structure | Gurtej S. Sandhu, Anand Srinivasan | 2005-10-04 |
| 6888212 | Method for trench isolation by selective deposition of low temperature oxide films | Gurtej S. Sandhu, Pai-Hung Pan | 2005-05-03 |
| 6864561 | Method and apparatus for reducing fixed charge in semiconductor device layers | Randhir P. S. Thakur, Howard E. Rhodes | 2005-03-08 |
| 6858526 | Methods of forming materials between conductive electrical components, and insulating materials | Werner Juengling, Kirk D. Prall, Gurtej S. Sandhu, Guy T. Blalock | 2005-02-22 |
| 6841463 | Interlevel dielectric structure and method of forming same | Gurtej S. Sandhu, Anand Srinivasan | 2005-01-11 |
| 6822303 | Titanium boride gate electrode and interconnect | — | 2004-11-23 |
| 6822328 | Integrated circuitry | Gurtej S. Sandhu | 2004-11-23 |
| 6815374 | Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers | — | 2004-11-09 |
| 6812160 | Methods of forming materials between conductive electrical components, and insulating materials | Werner Juengling, Kirk D. Prall, Gurtej S. Sandhu, Guy T. Blalock | 2004-11-02 |
| 6809025 | Method of making a void-free aluminum film | Gurtej S. Sandhu | 2004-10-26 |
| 6784122 | Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers | — | 2004-08-31 |
| 6777346 | Planarization using plasma oxidized amorphous silicon | — | 2004-08-17 |
| 6727190 | Method of forming fluorine doped boron-phosphorous silicate glass (F-BPSG) insulating materials | Anand Srinivasan, Gurtej S. Sandhu | 2004-04-27 |
| 6688584 | Compound structure for reduced contact resistance | Yongjun Jeff Hu, Luan C. Tran, Brent Gilgen | 2004-02-10 |
| 6667540 | Method and apparatus for reducing fixed charge in semiconductor device layers | Randhir P. S. Thakur, Howard E. Rhodes | 2003-12-23 |
| 6653234 | Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants | Sujit Sharan | 2003-11-25 |
| 6639319 | Conductive structure in an integrated circuit | Jigish Trivedi | 2003-10-28 |
| 6617246 | Semiconductor processing methods and integrated circuitry | Gurtej S. Sandhu | 2003-09-09 |
| 6613673 | Technique for elimination of pitting on silicon substrate during gate stack etch | Pai-Hung Pan, Louie Liu | 2003-09-02 |
| 6605502 | Isolation using an antireflective coating | Steven M. McDonald, Thomas R. Glass, Zhiping Yin | 2003-08-12 |
| 6576570 | Method for improving thickness uniformity of deposited ozone-teos silicate glass layers | — | 2003-06-10 |
| 6570252 | Integrated circuitry | Gurtej S. Sandhu | 2003-05-27 |