Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7718540 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2010-05-18 |
| 7659210 | Nano-crystal etch process | Ramakanth Alapati, Max Hineman | 2010-02-09 |
| 7651951 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Ramakanth Alapati, Sheron Honarkhah +7 more | 2010-01-26 |
| 7585782 | Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide | Joseph Neil Greeley | 2009-09-08 |
| 7253118 | Pitch reduced patterns relative to photolithography features | Luan C. Tran, William T. Rericha, John Lee, Raman Alapati, Sheron Honarkhah +7 more | 2007-08-07 |
| 7077975 | Methods and compositions for removing group VIII metal-containing materials from surfaces | — | 2006-07-18 |
| 7060631 | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates | — | 2006-06-13 |
| 7023099 | Wafer cleaning method and resulting wafer | Michael T. Andreas | 2006-04-04 |
| 6955995 | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates | — | 2005-10-18 |
| 6952360 | Device with layer edges separated through mechanical spacing | — | 2005-10-04 |
| 6933665 | Structure and method for field emitter tips | Terry L. Gilton | 2005-08-23 |
| 6930017 | Wafer Cleaning method and resulting wafer | Michael T. Andreas | 2005-08-16 |
| 6905974 | Methods using a peroxide-generating compound to remove group VIII metal-containing residue | — | 2005-06-14 |
| 6867148 | Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions | Donald L. Yates | 2005-03-15 |
| 6835668 | Copper post-etch cleaning process | Michael T. Andreas | 2004-12-28 |
| 6790786 | Etching processes for integrated circuit manufacturing including methods of forming capacitors | Patrick M. Flynn, Janos Fucsko | 2004-09-14 |
| 6787450 | High aspect ratio fill method and resulting structure | Nishant Sinha | 2004-09-07 |
| 6758938 | Delivery of dissolved ozone | Kevin J. Torek, Jonathan Morgan | 2004-07-06 |
| 6756682 | High aspect ratio fill method and resulting structure | Nishant Sinha | 2004-06-29 |
| 6737283 | Method to isolate device layer edges through mechanical spacing | — | 2004-05-18 |
| 6653243 | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates | — | 2003-11-25 |
| 6645874 | Delivery of dissolved ozone | Kevin J. Torek, Jonathan Morgan | 2003-11-11 |
| 6589882 | Copper post-etch cleaning process | Michael T. Andreas | 2003-07-08 |
| 6541391 | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates | David M. Smith, Kevin J. Torek | 2003-04-01 |
| 6417016 | Structure and method for field emitter tips | Terry L. Gilton | 2002-07-09 |