Issued Patents All Time
Showing 251–275 of 279 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE35420 | Method of increasing capacitance by surface roughening in semiconductor wafer processing | David A. Cathey, Tyler Lowrey | 1997-01-07 |
| 5584891 | Methods of forming a button-type battery terminal housing member sheet and of forming button-type batteries | — | 1996-12-17 |
| 5580674 | Method of producing button-type batteries and spring-biased concave button-type battery | John R. Tuttle | 1996-12-03 |
| 5558679 | Method for mounting a battery on a substrate | — | 1996-09-24 |
| 5547781 | Button-type battery with improved separator and gasket construction | Peter M. Blonsky | 1996-08-20 |
| 5542959 | Method of forming button-type battery lithium electrodes | — | 1996-08-06 |
| 5494495 | Method of forming button-type batteries | — | 1996-02-27 |
| 5486431 | Method of producing button-type batteries and spring-biased concave button-type battery | John R. Tuttle | 1996-01-23 |
| 5480834 | Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent | Rickie C. Lake | 1996-01-02 |
| 5480462 | Method of forming button-type battery lithium electrodes | — | 1996-01-02 |
| 5432027 | Button-type battery having bendable construction, and angled button-type battery | Peter M. Blonsky | 1995-07-11 |
| 5421769 | Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus | Laurence D. Schultz, Trung T. Doan | 1995-06-06 |
| 5384284 | Method to form a low resistant bond pad interconnect | Trung T. Doan | 1995-01-24 |
| 5297364 | Polishing pad with controlled abrasion rate | — | 1994-03-29 |
| 5275715 | Electroplating process for enhancing the conformality of titanium and titanium nitride films in the manufacture of integrated circuits and structures produced thereby | — | 1994-01-04 |
| 5244842 | Method of increasing capacitance by surface roughening in semiconductor wafer processing | David A. Cathey, Tyler Lowrey | 1993-09-14 |
| 5234867 | Method for planarizing semiconductor wafers with a non-circular polishing pad | Laurence D. Schultz, Trung T. Doan | 1993-08-10 |
| 5232875 | Method and apparatus for improving planarity of chemical-mechanical planarization operations | Trung T. Doan, Angus C. Fox, III, Gurtej S. Sandhu, Hugh E. Stroupe | 1993-08-03 |
| 5202278 | Method of forming a capacitor in semiconductor wafer processing | Viju K. Mathews, Chang Yu, Trung T. Doan | 1993-04-13 |
| 5177908 | Polishing pad | — | 1993-01-12 |
| 5151168 | Process for metallizing integrated circuits with electrolytically-deposited copper | Terry L. Gilton, David A. Cathey | 1992-09-29 |
| 5142438 | Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact | Alan R. Reinberg | 1992-08-25 |
| 5124780 | Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization | Gurtej S. Sandhu, Chang Yu, Trung T. Doan | 1992-06-23 |
| 5112773 | Methods for texturizing polysilicon utilizing gas phase nucleation | — | 1992-05-12 |
| 5102832 | Methods for texturizing polysilicon | — | 1992-04-07 |