Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417682 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Shyam Surthi | 2022-08-16 |
| 11411021 | Integrated assemblies and methods of forming integrated assemblies | John D. Hopkins | 2022-08-09 |
| 11404436 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2022-08-02 |
| 11393756 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Christian George Emor, Luca Fumagalli, John D. Hopkins, Rita J. Klein, Christopher W. Petz +1 more | 2022-07-19 |
| 11355392 | Conductive via of integrated circuitry, memory array comprising strings of memory cells, method of forming a conductive via of integrated circuitry, and method of forming a memory array comprising strings of memory cells | Yiping Wang, Collin Howder | 2022-06-07 |
| 11342265 | Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems | Lifang Xu, Rita J. Klein, Xiao Li, Everett A. McTeer | 2022-05-24 |
| 11315877 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | John D. Hopkins, Rita J. Klein, Everett A. McTeer, Lifang Xu, Daniel Billingsley +1 more | 2022-04-26 |
| 11302707 | Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies | John D. Hopkins | 2022-04-12 |
| 11244903 | Tungsten structures and methods of forming the structures | Christian George Emor, Travis Rampton, Everett A. McTeer, Rita J. Klein | 2022-02-08 |
| 11195848 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, Indra V. Chary, Rita J. Klein | 2021-12-07 |
| 11177276 | Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures | Nancy M. Lomeli, Tom George, Scott M. Pook, John Mark Meldrim | 2021-11-16 |
| 11158718 | Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material | Rita J. Klein, Everett A. McTeer, John Mark Meldrim | 2021-10-26 |
| 11127899 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Tao Nguyen, John Mark Meldrim, Aaron K. Belsher | 2021-09-21 |
| 11056505 | Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies | John D. Hopkins, Purnima Narayanan | 2021-07-06 |
| 11031417 | Methods used in forming an array of elevationally-extending transistors | John Mark Meldrim, E. Allen McTeer | 2021-06-08 |
| 11024644 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Shyam Surthi | 2021-06-01 |
| 11011408 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, Yongjun Jeff Hu | 2021-05-18 |
| 10957775 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2021-03-23 |
| 10943921 | Methods of forming integrated assemblies | Chet E. Carter, Collin Howder, John Mark Meldrim, Everett A. McTeer | 2021-03-09 |
| 10847367 | Methods of forming tungsten structures | David Ross Economy, Brian Beatty, John Mark Meldrim, Yongjun Jeff Hu | 2020-11-24 |
| 10840255 | Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures | John Mark Meldrim, Everett A. McTeer | 2020-11-17 |
| 10748921 | Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies | Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik +2 more | 2020-08-18 |
| 10727250 | Methods used in forming an array of elevationally-extending transistors | John Mark Meldrim, E. Allen McTeer | 2020-07-28 |
| 10573661 | Methods of filling horizontally-extending openings of integrated assemblies | Chet E. Carter, Collin Howder, John Mark Meldrim, Everett A. McTeer | 2020-02-25 |
| 10559579 | Assemblies having vertically-stacked conductive structures | John Mark Meldrim, Everett A. McTeer | 2020-02-11 |