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Semiconductor devices including a layer of polycrystalline silicon having a smooth morphology |
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2012-10-16 |
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Method for forming a self-aligned isolation structure utilizing sidewall spacers as an etch mask and remaining as a portion of the isolation structure |
Fernando Gonzalez, Randhir P. S. Thakur |
2012-05-08 |
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Method for forming a self-aligned T-shaped isolation trench |
Fernando Gonzalez, Ranshir P. S. Thakur |
2010-07-06 |
| 7235856 |
Trench isolation for semiconductor devices |
John T. Moore |
2007-06-26 |
| 6891245 |
Integrated circuit formed by removing undesirable second oxide while minimally affecting a desirable first oxide |
John T. Moore |
2005-05-10 |
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System for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2004-06-08 |
| 6597057 |
Epitaxial growth in a silicon-germanium semiconductor device with reduced contamination |
Klaus Schuegraf |
2003-07-22 |
| 6573478 |
Systems for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2003-06-03 |
| 6444591 |
Method for reducing contamination prior to epitaxial growth and related structure |
Klaus Schuegraf |
2002-09-03 |
| 6414275 |
Method and apparatus for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2002-07-02 |
| 6323101 |
Semiconductor processing methods, methods of forming silicon dioxide methods of forming trench isolation regions, and methods of forming interlevel dielectric layers |
Weimin Li, Trung T. Doan |
2001-11-27 |
| 6288367 |
Method and apparatus for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2001-09-11 |
| 6271152 |
Method for forming oxide using high pressure |
Randhir P. S. Thakur |
2001-08-07 |
| 6214697 |
Trench isolation for semiconductor devices |
John T. Moore |
2001-04-10 |
| 6174761 |
Method and apparatus for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2001-01-16 |
| 6165853 |
Trench isolation method |
Michael Nuttall, Kevin J. Torek |
2000-12-26 |
| 6143631 |
Method for controlling the morphology of deposited silicon on a silicon dioxide substrate and semiconductor devices incorporating such deposited silicon |
— |
2000-11-07 |
| 6097076 |
Self-aligned isolation trench |
Fernando Gonzalez, Randhir P. S. Thakur |
2000-08-01 |
| 6096660 |
Method for removing undesirable second oxide while minimally affecting a desirable first oxide |
John T. Moore |
2000-08-01 |
| 6096998 |
Method and apparatus for performing thermal reflow operations under high gravity conditions |
Karl M. Robinson |
2000-08-01 |
| 6066576 |
Method for forming oxide using high pressure |
Randhir P. S. Thakur |
2000-05-23 |
| 6051480 |
Trench isolation for semiconductor devices |
John T. Moore |
2000-04-18 |
| 5953621 |
Method for forming a self-aligned isolation trench |
Fernando Gonzalez, Randhir P. S. Thakur |
1999-09-14 |
| 5846888 |
Method for in-situ incorporation of desirable impurities into high pressure oxides |
Randhir P. S. Thakur |
1998-12-08 |
| 5711812 |
Apparatus for obtaining dose uniformity in plasma doping (PLAD) ion implantation processes |
Susan Felch, Michael William Kissick, Shamim M. Malik, Tienyu Sheng |
1998-01-27 |