YC

Ying-Chih Chen

ME Megica: 9 patents #10 of 32Top 35%
HA Hushan Autoparts: 6 patents #1 of 8Top 15%
ME Mediatek: 6 patents #467 of 2,888Top 20%
GI Gte Laboratories Incorporated: 6 patents #65 of 474Top 15%
TSMC: 5 patents #4,208 of 12,232Top 35%
IT ITRI: 5 patents #1,457 of 9,619Top 20%
TB The Boeing: 2 patents #209 of 1,309Top 20%
IC Inventec Besta Co.: 2 patents #1 of 10Top 10%
PC Pou Chen: 2 patents #6 of 23Top 30%
QU Qualcomm: 2 patents #5,578 of 12,104Top 50%
CU Chung Yuan Christian University: 1 patents #145 of 438Top 35%
MA Megit Acquisition: 1 patents #5 of 12Top 45%
NT National Taipei University Of Technology: 1 patents #78 of 314Top 25%
PU Polytechnic Institute Of New York University: 1 patents #39 of 85Top 50%
AE Advanced Semiconductor Engineering: 1 patents #625 of 1,073Top 60%
AT Airoha Technology: 1 patents #50 of 112Top 45%
Foxconn: 1 patents #3,106 of 5,504Top 60%
UF University Of Central Florida: 1 patents #520 of 1,118Top 50%
FC Fu Sheng Industrial Co.: 1 patents #16 of 42Top 40%
📍 Hsinchu, NJ: #7 of 42 inventorsTop 20%
Overall (All Time): #43,979 of 4,157,543Top 2%
56
Patents All Time

Issued Patents All Time

Showing 26–50 of 56 patents

Patent #TitleCo-InventorsDate
8742580 Method of wire bonding over active area of a semiconductor circuit Jin-Yuan Lee, Mou-Shiung Lin 2014-06-03
8426958 Stacked chip package with redistribution lines Mou-Shiung Lin, Shih-Hsiung Lin, Hsin-Jung Lo, Chiu-Ming Chou 2013-04-23
8320425 Pump cavities for diode laser array pumped laser rods Michael Bass 2012-11-27
8138079 Method of wire bonding over active area of a semiconductor circuit Jin-Yuan Lee, Mou-Shiung Lin 2012-03-20
8026588 Method of wire bonding over active area of a semiconductor circuit Jin-Yuan Lee, Mou-Shiung Lin 2011-09-27
8021976 Method of wire bonding over active area of a semiconductor circuit Jin-Yuan Lee 2011-09-20
7973401 Stacked chip package with redistribution lines Mou-Shiung Lin, Shih-Hsiung Lin, Hsin-Jung Lo, Chiu-Ming Chou 2011-07-05
7919412 Over-passivation process of forming polymer layer over IC chip Mou-Shiung Lin, Chiu-Ming Chou 2011-04-05
7845058 Method for assembling camera module 2010-12-07
7630594 Optical interconnection module Chun-Hsing Lee, Shin-Ge Lee, Cherng-Shiun Wu 2009-12-08
7592205 Over-passivation process of forming polymer layer over IC chip Chiu-Ming Chou, Mou-Shiung Lin 2009-09-22
7577321 Hybrid electro-optical circuit board and method for fabricating the same Chien-Chun Lu, Shin-Ge Lee, Chun-Hsing Lee, Shun-Tien Lee 2009-08-18
7521812 Method of wire bonding over active area of a semiconductor circuit Jin-Yuan Lee, Mou-Shiung Lin 2009-04-21
7508059 Stacked chip package with redistribution lines Mou-Shiung Lin, Shih-Hsiung Lin, Hsin-Jung Lo, Chiu-Ming Chou 2009-03-24
7295725 Electro-optical circuit board Cherng-Shiun Wu, Hsien-Huan Chiu, Shin-Ge Lee 2007-11-13
7249896 Array optical sub-assembly Yi-Ming Chen, Yao-Ling Cheng, Shun-Tien Lee 2007-07-31
7212702 Optoelectric converting substrate Yen-Yi Chu, Shun-Tien Lee 2007-05-01
7091583 Method and structure for prevention leakage of substrate strip Yun-Hsiang Tien, Ming-Jiun Lai, Yi Ding 2006-08-15
6948220 Pet collar buckle structure 2005-09-27
6739022 Rotary buckle structure 2004-05-25
6698984 Structure extendible tip shoring bar 2004-03-02
6521521 Bonding pad structure and method for fabricating the same Chih-Kung Huang 2003-02-18
5414724 Monolithic self Q-switched laser Shouhuan Zhou, Kotik K. Lee, Youxi Gui 1995-05-09
5319660 Multi-quantum barrier laser Harvey B. Serreze 1994-06-07
5197077 Low divergence laser Charlton M. Harding, Richard J. Dalby, Robert G. Waters 1993-03-23