| 8313580 |
Method for processing a substrate using a single phase proximity head having a controlled meniscus |
Mike Ravkin, John M. de Larios |
2012-11-20 |
| 7997288 |
Single phase proximity head having a controlled meniscus for treating a substrate |
Mike Ravkin, John M. de Larios |
2011-08-16 |
| 7351663 |
Removing whisker defects |
Hean Cheal Lee, Sundar Narayanan, Prabhuram Gopalan, Vinay Krishna |
2008-04-01 |
| 6641698 |
Integrated circuit fabrication dual plasma process with separate introduction of different gases into gas flow |
— |
2003-11-04 |
| 6461972 |
Integrated circuit fabrication dual plasma process with separate introduction of different gases into gas flow |
— |
2002-10-08 |
| 6346488 |
Process to provide enhanced resistance to cracking and to further reduce the dielectric constant of a low dielectric constant dielectric film of an integrated circuit structure by implantation with hydrogen ions |
— |
2002-02-12 |
| 6346490 |
Process for treating damaged surfaces of low k carbon doped silicon oxide dielectric material after plasma etching and plasma cleaning steps |
Wilbur G. Catabay, Wei-Jen Hsia |
2002-02-12 |
