Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8372249 | Photoreduction processing method of three-dimensional metal nanostructure | Takuo Tanaka, Satoshi Kawata | 2013-02-12 |
| 6063703 | Method for making metal interconnection | Hiroshi Shinriki, Takeshi Kaizuka, Tomohiro Ohta, Eiichi Kondoh, Hiroshi Yamamoto +3 more | 2000-05-16 |
| 6001736 | Method of manufacturing semiconductor device and an apparatus for manufacturing the same | Eiichi Kondo, Tomohiro Ohta, Yumiko Kawano, Takeshi Kaizuka, Shinpei Jinnouchi | 1999-12-14 |
| 5973402 | Metal interconnection and method for making | Hiroshi Shinriki, Takeshi Kaizuka, Tomohiro Ohta, Eiichi Kondoh, Hiroshi Yamamoto +3 more | 1999-10-26 |
| 5952723 | Semiconductor device having a multilevel interconnection structure | Hiroshi Yamamoto, Yumiko Kawano, Eiichi Kondoh, Tomoharu Katagiri, Tomohiro Ohta | 1999-09-14 |
| 5946799 | Multilevel interconnect method of manufacturing | Hiroshi Yamamoto, Tomohiro Ohta | 1999-09-07 |
| 5652180 | Method of manufacturing semiconductor device with contact structure | Hiroshi Shinriki, Hiroshi Yamamoto, Takayuki Komiya, Tomohiro Ohta | 1997-07-29 |
| 5637534 | Method of manufacturing semiconductor device having multilevel interconnection structure | Hiroshi Yamamoto, Yumiko Kawano, Eiichi Kondoh, Tomoharu Katagiri, Tomohiro Ohta | 1997-06-10 |
| 5627345 | Multilevel interconnect structure | Hiroshi Yamamoto, Tomohiro Ohta | 1997-05-06 |
| 5627102 | Method for making metal interconnection with chlorine plasma etch | Hiroshi Shinriki, Takeshi Kaizuka, Tomohiro Ohta, Eiichi Kondoh, Hiroshi Yamamoto +3 more | 1997-05-06 |
| 5486492 | Method of forming multilayered wiring structure in semiconductor device | Hiroshi Yamamoto, Tomohiro Ohta | 1996-01-23 |