HI

Hirofumi Inoue

KT Kabushiki Kaisha Toshiba: 39 patents #530 of 21,451Top 3%
Nissan Motor Co.: 18 patents #274 of 8,689Top 4%
TO Toyota: 14 patents #1,948 of 26,838Top 8%
NE Nec: 11 patents #1,181 of 14,502Top 9%
KC Kayaba Industry Co.: 8 patents #7 of 326Top 3%
SK Showa Denko K.K.: 7 patents #183 of 1,736Top 15%
Mitsubishi Electric: 3 patents #8,691 of 25,717Top 35%
Toshiba Memory: 3 patents #621 of 1,971Top 35%
EA Ems-Chemie Ag: 2 patents #19 of 85Top 25%
GT Group14 Technologies: 2 patents #86 of 259Top 35%
RE Resonac: 2 patents #101 of 474Top 25%
SI Sanyo Chemical Industries: 2 patents #123 of 607Top 25%
SC Shinwa Controls Co.: 2 patents #18 of 52Top 35%
RS Renault S.A.S.: 1 patents #417 of 1,209Top 35%
IBM: 1 patents #44,794 of 70,183Top 65%
PA Panasonic: 1 patents #13,264 of 21,108Top 65%
JT Jtekt: 1 patents #1,102 of 1,969Top 60%
Kioxia: 1 patents #1,054 of 1,813Top 60%
SA Siemens Aktiengesellschaft: 1 patents #10,653 of 22,248Top 50%
TC Tachikawa Spring Co.: 1 patents #29 of 77Top 40%
TT The University Of Tokyo: 1 patents #1,000 of 2,633Top 40%
KC Kyodo Yushi Co.: 1 patents #63 of 191Top 35%
Kubota: 1 patents #1,212 of 2,059Top 60%
NS Nippon Steel: 1 patents #2,111 of 4,423Top 50%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
📍 Tokyo, NY: #12 of 99 inventorsTop 15%
Overall (All Time): #11,650 of 4,157,543Top 1%
111
Patents All Time

Issued Patents All Time

Showing 101–111 of 111 patents

Patent #TitleCo-InventorsDate
6355717 Layered silicate-containing composite resin composition, and moulded barrier composite resin Kenji Tamura, Junichi Nakamura, Masayuki Noguchi, Tsuguo Ebata 2002-03-12
6326658 Semiconductor device including an interface layer containing chlorine Yoshitaka Tsunashima, Katsuya Okumura, Masayuki Tanaka, Shigehiko Saida, Takeshi Hamamoto 2001-12-04
6323272 Polyamide resin composition Kenji Tamura, Junichi Nakamura, Masayuki Noguchi, Tsuguo Ebata 2001-11-27
6294599 Highly-rigid, flame-resistant polyamide composite material Kenji Tamura, Tsuguo Ebata, Masayuki Noguchi 2001-09-25
6274663 Compound resin composition Teruo Hosokawa 2001-08-14
6074903 Method for forming electrical isolation for semiconductor devices Rajesh Rengarajan, Radhika Srinivasan, Jochen Beintner 2000-06-13
5939184 Polyolefin-based composite material containing a stratiform silicate and production process therefor Teruo Hosokawa 1999-08-17
5932634 Method of producing resin composition containing inorganic filler Teruo Hosokawa, Yoshihiro Moteki 1999-08-03
4737226 Method of manufacturing an automotive seat 1988-04-12
4381856 Method of repairing blast furnace wall lining Akihiko Inoue, Tsuyoshi Nakamura, Seiji Tobino, Masamitsu Baba 1983-05-03
4231022 Interpolative PCM decoder utilized for .mu.-law and A-law Hiroshi Kosugi, Hirotoshi Shirasu 1980-10-28