Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093730 | Underfilled semiconductor die assemblies and methods of forming the same | Cary J. Baerlocher | 2012-01-10 |
| 7993977 | Method of forming molded standoff structures on integrated circuit devices | James L. Voelz | 2011-08-09 |
| 7851907 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Cary J. Baerlocher | 2010-12-14 |
| 7642643 | Apparatus for molding a semiconductor die package with enhanced thermal conductivity | Todd O. Bolken | 2010-01-05 |
| 7498606 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units | Bret K. Street, James M. Derderian | 2009-03-03 |
| 7485971 | Electronic device package | Jason L. Fuller, Tongbi Jiang | 2009-02-03 |
| 7468559 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Cary J. Baerlocher | 2008-12-23 |
| 7416913 | Methods of manufacturing microelectronic imaging units with discrete standoffs | William Reeder, Bret K. Street, James M. Derderian | 2008-08-26 |
| 7417294 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units | William Reeder, Bret K. Street, James M. Derderian | 2008-08-26 |
| 7364934 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units | Bret K. Street, James M. Derderian | 2008-04-29 |
| 7342319 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Cary J. Baerlocher | 2008-03-11 |
| 7276802 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Cary J. Baerlocher | 2007-10-02 |
| 7268067 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | Cary J. Baerlocher | 2007-09-11 |
| 7262074 | Methods of fabricating underfilled, encapsulated semiconductor die assemblies | Cary J. Baerlocher | 2007-08-28 |
| 7116000 | Underfilled, encapsulated semiconductor die assemblies and methods of fabrication | Cary J. Baerlocher | 2006-10-03 |
| 7084515 | Electronic device package | Jason L. Fuller, Tongbi Jiang | 2006-08-01 |
| 6987058 | Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material | — | 2006-01-17 |
| 6969914 | Electronic device package | Jason L. Fuller, Tongbi Jiang | 2005-11-29 |
| 6835592 | Methods for molding a semiconductor die package with enhanced thermal conductivity | Todd O. Bolken | 2004-12-28 |
| 5072795 | Pressure compensator for drill bit lubrication system | Steve R. Delgado, Robert J. Kotch | 1991-12-17 |