Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394708 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2025-08-19 |
| 12334445 | Method of fabricating a semiconductor package | Myungsam Kang, Taesung Jeong | 2025-06-17 |
| 12327826 | Semiconductor package | Yongkoon Lee, Myungsam Kang | 2025-06-10 |
| 12278191 | Semiconductor packages having wiring patterns | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2025-04-15 |
| 12261105 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2025-03-25 |
| 12183665 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun | 2024-12-31 |
| 12159826 | Semiconductor package and method of manufacturing the semiconductor package | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2024-12-03 |
| 12119305 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 12094817 | Semiconductor package | Myungsam Kang, Kyungdon Mun | 2024-09-17 |
| 12046562 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2024-07-23 |
| 12040297 | Methods of manufacturing semiconductor packages | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2024-07-16 |
| 12021020 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2024-06-25 |
| 12002798 | Fan-out type semiconductor package and method of manufacturing the same | Myungsam Kang, Yongjin Park | 2024-06-04 |
| 11935847 | Semiconductor package | Myungsam Kang, Changbae Lee, Bongju Cho, Younggwan Ko, Yongkoon Lee +1 more | 2024-03-19 |
| 11916002 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun | 2024-02-27 |
| 11804444 | Semiconductor package including heat dissipation structure | Yongjin Park, Myungsam Kang, Seonho Lee | 2023-10-31 |
| 11784129 | Semiconductor package and method of fabricating the same | Myungsam Kang, Taesung Jeong | 2023-10-10 |
| 11721620 | Fan-out type semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2023-08-08 |
| 11626367 | Semiconductor package | Myungsam Kang, Kyungdon Mun | 2023-04-11 |
| 11581284 | Semiconductor package with under-bump metal structure | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2023-02-14 |
| 11569158 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2023-01-31 |
| 11569175 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |
| 11562966 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2023-01-24 |
| 11538737 | Semiconductor package | Myungsam Kang, Kyungdon Mun | 2022-12-27 |
| 11508639 | System in package (SiP) semiconductor package | Myungsam Kang, Yongjin Park | 2022-11-22 |