Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629461 | Apparatuses for bonding semiconductor chips | Jungchul Lee, Jaehong Kim, Taegyeong Chung | 2020-04-21 |
| 10083846 | Apparatuses for bonding semiconductor chips | Jungchul Lee, Jaehong Kim, Taegyeong Chung | 2018-09-25 |
| 9704732 | Apparatuses for bonding semiconductor chips | Jungchul Lee, Jaehong Kim, Taegyeong Chung | 2017-07-11 |
| 9698117 | Die bonding apparatus | Yongdae Ha, Jaeryoung Lee, Chulmin KIM, Teaseog Um, Yongjin Jung | 2017-07-04 |
| 9455165 | Die bonding device | Sugil Lee, Dongjun Kim, Yongdae Ha | 2016-09-27 |