Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456273 | Bonding head and a bonding apparatus having the same | Jaecheol Kim, Gilman Kang | 2022-09-27 |
| 10211084 | Chuck table and substrate processing system including the same | Doojin Kim, Youngsik Kim, Kunho Song | 2019-02-19 |
| 9698117 | Die bonding apparatus | Jaeryoung Lee, Chulmin KIM, Yisung Hwang, Teaseog Um, Yongjin Jung | 2017-07-04 |
| 9455165 | Die bonding device | Yisung Hwang, Sugil Lee, Dongjun Kim | 2016-09-27 |