Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698117 | Die bonding apparatus | Yongdae Ha, Jaeryoung Lee, Chulmin KIM, Yisung Hwang, Teaseog Um | 2017-07-04 |
| 9516133 | Information processing device, information processing method and information processing program | Kentaro Nakamura, Toru Sasaki, Akira Tange, Masafumi Matsuda, Kumiko Tokuhara +1 more | 2016-12-06 |
| 7989939 | Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire | Hyun-Ik Hwang, Kunho Song | 2011-08-02 |