Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989939 | Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire | Yongjin Jung, Kunho Song | 2011-08-02 |
| 7405105 | Stack package using anisotropic conductive film (ACF) and method of making same | Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung | 2008-07-29 |
| 7291925 | Stack package using anisotropic conductive film (ACF) and method of making same | Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung | 2007-11-06 |
| 7288436 | Semiconductor chip package manufacturing method including screen printing process | Sang-Young Kim, Gil-Beag Kim, Yong-Jin Jung, Jun-Soo Han | 2007-10-30 |