Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698117 | Die bonding apparatus | Yongdae Ha, Chulmin KIM, Yisung Hwang, Teaseog Um, Yongjin Jung | 2017-07-04 |
| 8703337 | High density cathode materials for secondary batteries | Robert Ellenwood, Jens Paulsen | 2014-04-22 |