Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10408756 | Analysis method and analysis apparatus | Michiko Noguchi, Mitsuo Ozaki | 2019-09-10 |
| 7291901 | Packaging method, packaging structure and package substrate for electronic parts | Masateru Koide, Misao Umematsu, Takashi Kanda, Kenji Fukuzono | 2007-11-06 |
| 7268002 | Packaging method, packaging structure and package substrate for electronic parts | Masateru Koide, Misao Umematsu, Takashi Kanda, Kenji Fukuzono | 2007-09-11 |
| 6869822 | Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening | Tomohisa Yagi, Nobuhiro Imaizumi, Kenji Fukuzono | 2005-03-22 |
| 6057168 | Method for forming bumps using dummy wafer | Kiyotaka Seyama, Hideki Ota, Kazuaki Satoh | 2000-05-02 |