| 8501504 |
Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer |
Kok Yong Yiang, Rick Francis, Amit P. Marathe |
2013-08-06 |
| 8022716 |
Dielectric breakdown lifetime enhancement using alternating current (AC) capacitance |
Kok Yong Yiang, Rick Francis, Amit P. Marathe |
2011-09-20 |
| 6770847 |
Method and system for Joule heating characterization |
Huade Walter Yao, Amit P. Marathe |
2004-08-03 |
| 6329831 |
Method and apparatus for reliability testing of integrated circuit structures and devices |
Nguyen Duc Bui, Michael Anthony Niederhofer |
2001-12-11 |
| 6100101 |
Sensitive technique for metal-void detection |
Amit P. Marathe, Nguyen Duc Bui |
2000-08-08 |
| 6075293 |
Semiconductor device having a multi-layer metal interconnect structure |
Xiao-Yu Li, Sunil Mehta, Amit P. Marathe |
2000-06-13 |
| 5786705 |
Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems |
Nguyen Duc Bui, John T. Yue |
1998-07-28 |
| 5612627 |
Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems |
Nguyen Duc Bui, John T. Yue |
1997-03-18 |
