Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12055821 | Structure and method of bi-layer pixel isolation in advanced LCOS back-plane | Lan Yu, Benjamin D. Briggs, Zihao Yang | 2024-08-06 |
| 12033964 | Chemical mechanical polishing for copper dishing control | Joseph F. Salfelder, Ki Cheol Ahn, Kai Ma, Raghav Sreenivasan, Jason Appell | 2024-07-09 |
| 11908678 | Method of CMP integration for improved optical uniformity in advanced LCOS back-plane | Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan, Joseph F. Salfelder | 2024-02-20 |
| 11880052 | Structure and method of mirror grounding in LCoS devices | Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan | 2024-01-23 |
| 11881539 | Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization | Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan | 2024-01-23 |
| 11830824 | Edge protection on semiconductor substrates | Amirhasan Nourbakhsh, Lan Yu, Joseph F. Salfelder, Ki Cheol Ahn, Siddarth A. Krishnan +2 more | 2023-11-28 |
| 11769665 | Power device structures and methods of making | Amirhasan Nourbakhsh, Raman Gaire, Lan Yu, Roger QUON, Siddarth A. Krishnan | 2023-09-26 |
| 11705490 | Graded doping in power devices | Ashish Pal, El Mehdi Bazizi, Siddarth A. Krishnan, Xing Chen, Lan Yu | 2023-07-18 |
| 11605741 | Methods of forming doped silicide power devices | Joshua S. Holt, Lan Yu, Archana Kumar, Nicolas L. Breil, Siddarth A. Krishnan | 2023-03-14 |
| 11586067 | Structure and method of advanced LCoS back-plane having robust pixel via metallization | Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan | 2023-02-21 |
| 11573452 | Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes | Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan | 2023-02-07 |
| 11456171 | Deep trench integration processes and devices | Lan Yu | 2022-09-27 |
| 11410873 | Deep trench integration processes and devices | Lan Yu, Michael Chudzik, Siddarth A. Krishnan | 2022-08-09 |