Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6218320 | Method for improving the uniformity of wafer-to-wafer film thickness | Tsung-Lin Lu, Ping-Chung Chung, Yun-Sueng Liou, Yung-Chun Wen | 2001-04-17 |
| 6211060 | Method for planarizing a damascene structure | Tsung-Lin Lu | 2001-04-03 |
| 6132078 | Slurry providing system | — | 2000-10-17 |
| 6100205 | Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process | Chih-Chien Liu, J. Y. Wu, Water Lur, Shih-Wei Sun | 2000-08-08 |
| 6077147 | Chemical-mechanical polishing station with end-point monitoring device | Ming-Sheng Yang, Hsueh-Chung Chen, Juan-Yuan Wu | 2000-06-20 |