Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410942 | Semiconductor device package and method for manufacturing the same | Ian HU, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu | 2019-09-10 |
| 7964949 | Tenon-and-mortise packaging structure | Yi-Shao Lai, Tsung-Yueh Tsai, Hsiao-Chuan Chang | 2011-06-21 |