Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418130 | Connection body and method for manufacturing connection body | Ryosuke Odaka, Ryo Ito, Hiroyuki Kumakura, Daisuke Sato, Katsuhisa Orihara +1 more | 2025-09-16 |
| 12312514 | Method for manufacturing smart card | Ryosuke Odaka, Morio Sekiguchi, Hiroyuki Kumakura | 2025-05-27 |
| 11536518 | Fabrication method for loop heat pipe | Takeshi Shioga | 2022-12-27 |
| 11330710 | Metal-clad laminated board, metal member provided with resin, and wiring board | Tatsuya Arisawa, Hirohisa Goto | 2022-05-10 |
| 11267225 | Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board | Tatsuya Arisawa, Shunji Araki, Yuki Inoue | 2022-03-08 |
| 11078361 | Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Tatsuya Arisawa, Hirohisa Goto | 2021-08-03 |
| 10881021 | Loop heat pipe and fabrication method therefor, and electronic device | Takeshi Shioga | 2020-12-29 |
| 10624238 | Loop heat pipe and manufacturing method for loop heat pipe and electronic device | Takeshi Shioga | 2020-04-14 |
| 10566219 | Chip transfer member, chip transfer apparatus, and chip transfer method | Yoichiro Kurita, Hideto Furuyama | 2020-02-18 |
| 10557063 | Double-sided black adhesive tape | — | 2020-02-11 |
| 10420253 | Loop heat pipe, manufacturing method thereof, and electronic device | Takeshi Shioga | 2019-09-17 |
| 9783087 | Seat structure of vehicle | Koji Kuroda, Junsuke Inoue, Ryo Sawai | 2017-10-10 |
| 9775239 | Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board | Tatsuya Arisawa, Yoshihiko Nakamura, Kiyotaka Komori, Syouji Hasimoto, Mitsuyoshi Nishino | 2017-09-26 |
| 9710974 | Video game processing apparatus and video game processing program | Ryutaro Ichimura, Toru Nakazawa | 2017-07-18 |
| 9206308 | Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board | Tomoaki Iwami, Masaaki Matsumoto, Tatsuo Yonemoto, Hiroaki Fujiwara | 2015-12-08 |
| 8642894 | Circuit board, method of manufacturing the same, and resistance element | Norikazu Ozaki | 2014-02-04 |
| 8257542 | Multilevel interconnection board and method of fabricating the same | Keishiro Okamoto, Mamoru Kurashina | 2012-09-04 |
| 8250680 | Urinal | Kensuke Murata, Masayuki Nagaishi, Hiroshi Tsuboi | 2012-08-28 |
| 8186052 | Method of producing substrate | Kenji Iida, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-05-29 |
| 8178791 | Wiring substrate including conductive core substrate, and manufacturing method thereof | Kazumasa Saito, Shin Hirano, Kenji Iida | 2012-05-15 |
| 8171578 | Water discharge system | Masami Tsujita, Naoki Kabe, Hiroshi Tsuboi, Masayuki Nagaishi, Katsuhisa Tsuchiya +2 more | 2012-05-08 |
| 8158503 | Multilayer interconnection substrate and method of manufacturing the same | — | 2012-04-17 |
| 8153908 | Circuit board and method of producing the same | Kenji Iida, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-04-10 |
| 8151456 | Method of producing substrate | Yasutomo Maehara, Kenji Iida, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-04-10 |
| 8119925 | Core substrate and printed wiring board | Hideaki Yoshimura, Kenji Iida, Yasutomo Maehara, Takashi Nakagawa, Shin Hirano | 2012-02-21 |