| 8228679 |
Connections for electronic devices on double-sided circuit board |
Todd Snider, Melissa Grupen-Shemansky |
2012-07-24 |
| 8133799 |
Controlling warping in integrated circuit devices |
John W. Osenbach, Weidong Xie |
2012-03-13 |
| 7982307 |
Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate |
Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro |
2011-07-19 |
| 7923347 |
Controlling warping in integrated circuit devices |
John W. Osenbach, Weidong Xie |
2011-04-12 |
| 7598602 |
Controlling warping in integrated circuit devices |
John W. Osenbach, Weidong Xie |
2009-10-06 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Patrick Carberry, Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach +1 more |
2009-06-02 |
| 7433192 |
Packaging for electronic modules |
Timothy Brooks Bambridge, Juan Alejandro Herbsommer, Osvaldo Jorge Lopez, Joel M. Lott, Hugo Safar |
2008-10-07 |
| 7408246 |
Controlling warping in integrated circuit devices |
John W. Osenbach, Weidong Xie |
2008-08-05 |
| 7242090 |
Device package |
John Brennan, Joseph Freund, Ralph Salvatore Moyer, John W. Osenbach, Hugo Safar |
2007-07-10 |
| 7224047 |
Semiconductor device package with reduced leakage |
Patrick Carberry, Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach +1 more |
2007-05-29 |
| 6890445 |
Process for packaging electronic devices using thin bonding regions |
Bradley Paul Barber, LaRue Norman Dunkleberger, Jason Goodelle |
2005-05-10 |
| 6833557 |
Integrated circuit and a method of manufacturing an integrated circuit |
Vivian W. Ryan |
2004-12-21 |
| 6621280 |
Method of testing an integrated circuit |
Vivian W. Ryan |
2003-09-16 |