Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702335 | Low stress integrated device package | Yeonsung Kim, Shafi Saiyed | 2023-07-18 |
| 10800651 | Low stress integrated device packages | — | 2020-10-13 |
| 10287161 | Stress isolation features for stacked dies | Xiaojie Xue, Michael J. Zylinski, Kathleen O'Donnell | 2019-05-14 |
| 9698127 | Integrated device die and package with stress reduction features | Xiaojie Xue | 2017-07-04 |
| 9573800 | Pre-molded MEMS device package having conductive column coupled to leadframe and cover | — | 2017-02-21 |
| 9533878 | Low stress compact device packages | Kathleen O'Donnell, Michael D. Delaus | 2017-01-03 |
| 9475694 | Two-axis vertical mount package assembly | Arturo Martizon, Jr. | 2016-10-25 |
| 9407997 | Microphone package with embedded ASIC | Michael D. Delaus, Kathy O'Donnell | 2016-08-02 |
| 9343367 | Integrated device die and package with stress reduction features | Xiaojie Xue | 2016-05-17 |
| 9260293 | Pre-molded MEMS device package with conductive shell | — | 2016-02-16 |
| 9258634 | Microphone system with offset apertures | Jicheng Yang | 2016-02-09 |
| 9215519 | Reduced footprint microphone system with spacer member having through-hole | — | 2015-12-15 |
| 9209121 | Double-sided package | Xiaojie Xue | 2015-12-08 |
| 9162872 | Pre-molded MEMS device package having conductive column coupled to leadframe and cover | — | 2015-10-20 |
| 9142470 | Packages and methods for packaging | Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard J. Sullivan +2 more | 2015-09-22 |
| 9079760 | Integrated microphone package | Jason P. Fiorillo | 2015-07-14 |
| 8946879 | Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die | — | 2015-02-03 |
| 8941223 | MEMS device package with conductive shell | — | 2015-01-27 |
| 8779535 | Packaged integrated device die between an external and internal housing | Jicheng Yang | 2014-07-15 |
| 8723308 | Packages and methods for packaging using a lid having multiple conductive layers | Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan +2 more | 2014-05-13 |
| 8624380 | Vertical mount package for MEMS sensors | Xiaojie Xue, Carl Raleigh | 2014-01-07 |
| 8447057 | Packages and methods for packaging MEMS microphone devices | Jicheng Yang, Woodrow Beckford | 2013-05-21 |
| 8174111 | Vertical mount package for MEMS sensors | Xiaojie Xue, Carl Raleigh | 2012-05-08 |
| 7939916 | Wafer level CSP packaging concept | Alan J. O'Donnell, Oliver Kierse | 2011-05-10 |
| 7871865 | Stress free package and laminate-based isolator package | Dipak Sengupta | 2011-01-18 |