Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6539137 | Thermo-electric signal coupler | Larry L. Moresco, Vivek Mansingh | 2003-03-25 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 2000-08-15 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 1998-12-29 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +3 more | 1998-07-14 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +3 more | 1996-08-06 |
| 5181317 | Method of making an engineering change to a printed wiring board | Mikio Nishihara, Kiyotaka Seyama, Kiyoshi Kuwabara, Osamu Ohshima | 1993-01-26 |
| 5017738 | Connecting apparatus | Hiroki Tsuji, Kyoichiro Kawano | 1991-05-21 |
| 4998884 | Connector apparatus for high density coaxial cables | Kouji Ishikawa, Kyoichiro Kawano, Jerzy Roman Sochor, C. Timothy Norman | 1991-03-12 |
| 4815987 | Electrical connector | Kyoichiro Kawano, Hiroki Tsuji | 1989-03-28 |
| 4352533 | Connector device for printed boards | Kyoichiro Kawano, Akiyoshi Oshitani | 1982-10-05 |
| 4237606 | Method of manufacturing multilayer ceramic board | Koichi Niwa, Masatoshi Fujimori, Kyohei Murakawa | 1980-12-09 |