TM

Takehiko Maeda

RE Renesas Electronics: 12 patents #246 of 4,529Top 6%
NE Nec: 8 patents #1,742 of 14,502Top 15%
NE Nec Electronics: 6 patents #86 of 1,789Top 5%
Overall (All Time): #235,459 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11270971 Semiconductor device and method of manufacturing the same Kenji Ikura, Hideki Ishii, Takeumi KATO 2022-03-08
10895373 Light projection device 2021-01-19
10181450 Method of manufacturing semiconductor device Seiya Isozaki, Takashi Moriyama 2019-01-15
9853005 Semiconductor device and method of manufacturing the same Akira Yajima, Satoshi Itou, Fumiyoshi Kawashiro 2017-12-26
9659888 Semiconductor device Makio Okada 2017-05-23
9299632 Semiconductor device Makio Okada 2016-03-29
8975150 Semiconductor device manufacturing method Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Masaya Kawano +1 more 2015-03-10
8536691 Semiconductor device and method for manufacturing the same Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Takuo Funaya +3 more 2013-09-17
8389414 Method of manufacturing a wiring board Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more 2013-03-05
8043953 Semiconductor device including an LSI chip and a method for manufacturing the same Hideya Murai, Yuji Kayashima, Shintaro Yamamichi, Takuo Funaya 2011-10-25
8035217 Semiconductor device and method for manufacturing same Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Masaya Kawano +1 more 2011-10-11
7999401 Semiconductor device and method of manufacturing same Hideya Murai, Kentaro Mori, Shintaro Yamamichi, Masaya Kawano, Kouji Soejima 2011-08-16
7911038 Wiring board, semiconductor device using wiring board and their manufacturing methods Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more 2011-03-22
7838779 Wiring board, method for manufacturing same, and semiconductor package Shintaro Yamamichi, Katsumi Kikuchi, Hideya Murai, Takuo Funaya, Kenta Ogawa +2 more 2010-11-23
7745736 Interconnecting substrate and semiconductor device Kenta Ogawa, Jun Tsukano, Tadanori Shimoto, Shintaro Yamamichi, Kazuhiro Baba 2010-06-29
7701726 Method of manufacturing a wiring substrate and semiconductor device Jun Tsukano, Kenta Ogawa, Shintaro Yamamichi, Katsumi Kikuchi 2010-04-20
7674989 Wiring board and method for manufacturing the same Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Hirokazu Honda +2 more 2010-03-09
7649749 Wiring substrate, semiconductor device, and method of manufacturing the same Jun Tsukano, Kenta Ogawa, Shintaro Yamamichi, Katsumi Kikuchi 2010-01-19
6762488 Light thin stacked package semiconductor device and process for fabrication thereof Jun Tsukano 2004-07-13