| 12396097 |
Substrates with continuous slot vias |
Travis M. Jensen, Walter L. Moden |
2025-08-19 |
| 11942404 |
Apparatuses and systems having ball grid arrays and associated microelectronic devices and device packages |
Matthew B. Leslie, Timothy M. Hollis, Scott R. Cyr, Matthew A. Prather, Scott E. Smith |
2024-03-26 |
| 7951646 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Steven G. Thummel, Dana A. Stoddard +1 more |
2011-05-31 |
| 7335978 |
Semiconductor component having stiffener, circuit decal and terminal contacts |
— |
2008-02-26 |
| 7268018 |
Method for fabricating semiconductor component with stiffener and circuit decal |
— |
2007-09-11 |
| 7115982 |
Semiconductor component having stiffener, stacked dice and circuit decals |
— |
2006-10-03 |
| 7061085 |
Semiconductor component and system having stiffener and circuit decal |
— |
2006-06-13 |
| 6995026 |
Methods for coupling a flowable conductive material to microelectronic substrates |
William R. Stephenson |
2006-02-07 |
| 6936916 |
Microelectronic assemblies and electronic devices including connection structures with multiple elongated members |
William R. Stephenson |
2005-08-30 |
| 6913952 |
Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages |
Lee Teck Kheng, Steve Thummel |
2005-07-05 |
| 6914326 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Steven G. Thummel, Dana A. Stoddard +1 more |
2005-07-05 |
| 6870276 |
Apparatus for supporting microelectronic substrates |
William R. Stephenson |
2005-03-22 |
| 6577004 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, Patrick W. Tandy, William Reeder, Steven G. Thummel, Dana A. Stoddard +1 more |
2003-06-10 |
