Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7581666 | Wire-bonding method for wire-bonding apparatus | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Chih-Nan Wei +2 more | 2009-09-01 |
| 7547575 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin +2 more | 2009-06-16 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou +2 more | 2008-11-04 |