Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691957 | Light emitting device package | Sang Hyun Lee, Dong-hyuck KAM, Gam Han Yong, Jin-Gi Hong | 2017-06-27 |
| 9577147 | Light emitting device package and manufacturing method thereof | Sang Hyun Lee | 2017-02-21 |
| 9472722 | Light emitting device package and manufacturing method thereof | Sang Hyun Lee | 2016-10-18 |
| 9269877 | Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2016-02-23 |
| 9165817 | Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same | Jae Yoon Kim, Seung Jae Lee, Ha Yeong Son, Jin-Gi Hong | 2015-10-20 |
| 9070852 | Light emitting device package and manufacturing method thereof | Sang Hyun Lee | 2015-06-30 |
| 9065033 | Light emitting device package | Sang Hyun Lee, Dong-hyuck KAM, Gam Han Yong, Jin-Gi Hong | 2015-06-23 |
| 8987022 | Light-emitting device package and method of manufacturing the same | Cheol Jun Yoo, Young-Hee Song, Sang Hyun Lee | 2015-03-24 |
| 8896078 | Light emitting apparatus | Dong-hyuck KAM, Jae-Pil Kim, Sang-Bin Song, Wan Ho Kim, Sie-Wook Jeon | 2014-11-25 |
| 8847270 | LED package with recess and protrusions | Hun Yong PARK, Won Ho Jung | 2014-09-30 |
| 8828756 | Wafer level light-emitting device package and method of manufacturing the same | — | 2014-09-09 |
| 8809888 | Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2014-08-19 |
| 8735276 | Semiconductor packages and methods of manufacturing the same | Hyun-Soo Chung, Jae-Shin Cho, Dong-Ho Lee, Dong-Hyeon Jang, Seung-Duk Baek | 2014-05-27 |
| 8722435 | Light emitting device package and method of manufacturing the same | Cheol Jun Yoo, Young-Hee Song, Sang Hyun Lee | 2014-05-13 |
| 8679872 | Light emitting device package and manufacturing method thereof | Cheol Jun Yoo, Young-Hee Song, Sang Hyun Lee | 2014-03-25 |
| 8637881 | Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2014-01-28 |
| 8587010 | Light emitting device package and method of manufacturing the same | Cheol Jun Yoo, Young-Hee Song, Sang Hyun Lee | 2013-11-19 |
| 8415181 | Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2013-04-09 |
| 8319238 | Light emitting device with improved light extraction efficiency | Seung Jae Lee, Yu-Sik Kim, Sun-Pil Youn | 2012-11-27 |
| 8178424 | Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2012-05-15 |
| 8110922 | Wafer level semiconductor module and method for manufacturing the same | Hyun-Soo Chung, Seung-Duk Baek, Dong-Ho Lee, Dong-Hyeon Jang | 2012-02-07 |
| 8110843 | Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device | Yu-Sik Kim, Seung Jae Lee, Sun-Pil Youn | 2012-02-07 |
| 8111520 | Semiconductor module | Hyun-Soo Chung, Dong-Ho Lee, Dong-Han Kim, Ki Hyuk Kim | 2012-02-07 |
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee | 2011-10-18 |
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Hyun-Soo Chung, Jae-Shin Cho, Jum-Gon Kim, Ki Hyuk Kim | 2011-06-28 |