Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833897 | Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface | Sarah H. Knickerbocker, John J. Garant, Jerry A. Gorrell, Phillip W. Palmatier, Christopher L. Tessler | 2010-11-16 |
| 5667516 | Mechanism for cutting an umbilical cord | — | 1997-09-16 |