Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D830093 | Headrest for automobile having speakers | Sang Hun Yoo, Hyung-Soo Kim, Sung-hee Lee, Han Tae Kang | 2018-10-09 |
| D816567 | Steering wheel for automobile | Sang Hun Yoo, Sung-hee Lee, Han Tae Kang, Hyung-Soo Kim | 2018-05-01 |
| D804393 | Console for automobile | Sang Hun Yoo, Sung-hee Lee, Han Tae Kang, Hyung-Soo Kim | 2017-12-05 |
| 7939410 | Semiconductor device and manufacturing method thereof | — | 2011-05-10 |
| 5964030 | Mold flow regulating dam ring | William Loh | 1999-10-12 |
| 5924190 | Methods and apparatus for manufacturing encapsulated integrated circuits | Che-Yuan Chen | 1999-07-20 |
| 5839184 | Method for creating on-package inductors for use with integrated circuits | Peter Chi Fai Ho, D. Douglas Baumann | 1998-11-24 |
| 5825623 | Packaging assemblies for encapsulated integrated circuit devices | Che-Yuan Chen | 1998-10-20 |
| 5641988 | Multi-layered, integrated circuit package having reduced parasitic noise characteristics | Chin-Ching Huang, Ramachandra A. Rao, Fernand N. Forcier, Jr. | 1997-06-24 |
| 5625225 | Multi-layered, integrated circuit package having reduced parasitic noise characteristics | Chin-Ching Huang, Ramachandra A. Rao, Fernand N. Forcier, Jr. | 1997-04-29 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | Richard L. Groover, William K. Shu, George Fujimoto | 1997-01-28 |
| 5448825 | Method of making electrically and thermally enhanced integrated-circuit package | William Loh | 1995-09-12 |
| 5441684 | Method of forming molded plastic packages with integrated heat sinks | — | 1995-08-15 |
| 5430331 | Plastic encapsulated integrated circuit package having an embedded thermal dissipator | Ahmad Hamzehdoost | 1995-07-04 |
| 5379187 | Design for encapsulation of thermally enhanced integrated circuits | George Fujimoto | 1995-01-03 |
| 5378297 | Ferrite chip bead and method for making same | Dong-Sik Chang | 1995-01-03 |
| 5359227 | Lead frame assembly and method for wiring same | Louis H. Liang | 1994-10-25 |
| 5340422 | Method for making ferrite chip bead array | Dong-Sik Chang | 1994-08-23 |
| 5332864 | Integrated circuit package having an interposer | Louis H. Liang, Young I. Kwon | 1994-07-26 |
| 5331511 | Electrically and thermally enhanced integrated-circuit package | William Loh | 1994-07-19 |
| 5296744 | Lead frame assembly and method for wiring same | Louis H. Liang | 1994-03-22 |