Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7279369 | Germanium on insulator fabrication via epitaxial germanium bonding | Mohamad A. Shaheen | 2007-10-09 |
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction | Shriram Ramanathan, Gregory M. Chrysler, David Chau | 2007-05-01 |
| 7161224 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process | Peter G. Tolchinsky, Mohamad A. Shaheen, Irwin Yablok | 2007-01-09 |
| 7148122 | Bonding of substrates | Mohamad A. Shaheen, Maxim Kelman | 2006-12-12 |
| 6908027 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process | Peter G. Tolchinsky, Mohamad A. Shaheen, Irwin Yablok | 2005-06-21 |
| 6833195 | Low temperature germanium transfer | Mohamad A. Shaheen | 2004-12-21 |