Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6753688 | Interconnect package cluster probe short removal apparatus and method | Roger M. Eddy, Charles J. Hendricks, Thomas Morrison, Brian J. Wojszynski | 2004-06-22 |
| 6429672 | Contamination-tolerant electrical test probe | Yuet-Ying Yu | 2002-08-06 |
| 6391669 | Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices | Benjamin V. Fasano, Hai P. Longworth, Vincent P. Peterson, Anthony L. Plachy | 2002-05-21 |