| 12170240 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Maiden Grace Maming, Jefferson Talledo |
2024-12-17 |
| 12159820 |
Flat no-lead package with surface mounted structure |
Aiza Marie Agudon, Maiden Grace Maming |
2024-12-03 |
| 12074100 |
Flat no-lead package with surface mounted structure |
Aiza Marie Agudon, Maiden Grace Maming |
2024-08-27 |
| 11688715 |
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame |
Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera |
2023-06-27 |
| 11664239 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Maiden Grace Maming, Jefferson Talledo |
2023-05-30 |
| 11552007 |
Modified leadframe design with adhesive overflow recesses |
Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido |
2023-01-10 |
| 11404355 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same |
Bryan Christian Bacquian, Maiden Grace Maming, David Gani |
2022-08-02 |
| 11152326 |
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame |
Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera |
2021-10-19 |
| 11037864 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Maiden Grace Maming, Jefferson Talledo |
2021-06-15 |
| 10957634 |
Modified leadframe design with adhesive overflow recesses |
Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido |
2021-03-23 |
| 10892212 |
Flat no-lead package with surface mounted structure |
Aiza Marie Agudon, Maiden Grace Maming |
2021-01-12 |
| 10796984 |
Leadframe having a conductive layer protruding through a lead recess |
Raymond Albert Narvadez, Ernesto Antilano, Jr. |
2020-10-06 |
| 10763194 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same |
Bryan Christian Bacquian, Maiden Grace Maming, David Gani |
2020-09-01 |
| 10615104 |
Modified leadframe design with adhesive overflow recesses |
Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido |
2020-04-07 |
| 10535588 |
Die with metallized sidewall and method of manufacturing |
Aiza Marie Agudon, Jefferson Talledo |
2020-01-14 |
| 10109563 |
Modified leadframe design with adhesive overflow recesses |
Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido |
2018-10-23 |
| 9953933 |
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die |
Aaron Cadag, Ela Mia Cadag |
2018-04-24 |
| 9761538 |
Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer |
Frederick Arellano, Aiza Marie Agudon |
2017-09-12 |