Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605609 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2023-03-14 |
| 11177204 | Power electronics package and method of manufacturing thereof | Arun Virupaksha Gowda, Nancy Cecelia Stoffel, Risto Tuominen | 2021-11-16 |
| 10607957 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2020-03-31 |
| 10453786 | Power electronics package and method of manufacturing thereof | Arun Virupaksha Gowda, Nancy Cecelia Stoffel, Risto Tuominen | 2019-10-22 |
| 10276486 | Stress resistant micro-via structure for flexible circuits | Thomas Bert Gorczyca, Richard Joseph Saia | 2019-04-30 |
| 10269688 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2019-04-23 |
| 10204881 | Power overlay structure and reconstituted semiconductor wafer having wirebonds | Arun Virupaksha Gowda | 2019-02-12 |
| 10186477 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2019-01-22 |
| 10141251 | Electronic packages with pre-defined via patterns and methods of making and using the same | Arun Virupaksha Gowda, Risto Tuominen | 2018-11-27 |
| 10141203 | Electrical interconnect structure for an embedded electronics package | Arun Virupaksha Gowda | 2018-11-27 |
| 10068840 | Electrical interconnect for an integrated circuit package and method of making same | Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2018-09-04 |
| 9953913 | Electronics package with embedded through-connect structure and method of manufacturing thereof | Arun Virupaksha Gowda, Raymond Albert Fillion | 2018-04-24 |
| 9953917 | Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof | Arun Virupaksha Gowda, Raymond Albert Fillion | 2018-04-24 |
| 9847236 | Electrical interconnect structure for an embedded electronics package | Arun Virupaksha Gowda | 2017-12-19 |
| 9806051 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2017-10-31 |
| 9704788 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2017-07-11 |
| 9679837 | Electrical interconnect for an integrated circuit package and method of making same | Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2017-06-13 |
| 9653438 | Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda | 2017-05-16 |
| 9613932 | Integrated circuit package and method of making same | Arun Virupaksha Gowda | 2017-04-04 |
| 9613843 | Power overlay structure having wirebonds and method of manufacturing same | Arun Virupaksha Gowda | 2017-04-04 |
| 9570376 | Electrical interconnect for an integrated circuit package and method of making same | Arun Virupaksha Gowda, Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2017-02-14 |
| 9391027 | Embedded semiconductor device package and method of manufacturing thereof | Shakti Singh Chauhan, Arun Virupaksha Gowda | 2016-07-12 |
| 9299647 | Electrical interconnect for an integrated circuit package and method of making same | Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2016-03-29 |
| 9299630 | Diffusion barrier for surface mount modules | Arun Virupaksha Gowda, Ri-an Zhao, Shakti Singh Chauhan | 2016-03-29 |
| 9236348 | Ultrathin buried die module and method of manufacturing thereof | Scott Smith, Elizabeth Ann Burke | 2016-01-12 |