Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8791372 | Reducing impedance discontinuity in packages | Douglas O. Powell, Wolfgang Sauter, Yaping Zhou | 2014-07-29 |
| 8631706 | Noise suppressor for semiconductor packages | Nickolaus J. Gruendler, Tae Hong Kim, Sang-Yeol Lee, Michael J. Shapiro | 2014-01-21 |
| 8440917 | Method and apparatus to reduce impedance discontinuity in packages | Douglas O. Powell, Wolfgang Sauter, Yaping Zhou | 2013-05-14 |
| 8338949 | System to improve coreless package connections | Colm B. O'Reilly, Samuel W. Yang, Yaping Zhou | 2012-12-25 |
| 8222739 | System to improve coreless package connections | Colm B. O'Reilly, Samuel W. Yang, Yaping Zhou | 2012-07-17 |
| 8153516 | Method of ball grid array package construction with raised solder ball pads | — | 2012-04-10 |
| 7911049 | Electrically optimized and structurally protected via structure for high speed signals | Kazushige Kawasaki, Gen Yamada | 2011-03-22 |
| 7816754 | Ball grid array package construction with raised solder ball pads | — | 2010-10-19 |
| 7687391 | Electrically optimized and structurally protected via structure for high speed signals | Kazushige Kawasaki, Gen Yamada | 2010-03-30 |
| 7492570 | Systems and methods for reducing simultaneous switching noise in an integrated circuit | Eiichi Hosomi | 2009-02-17 |
| 7482654 | MOSgated power semiconductor device with source field electrode | Jianjun Cao, Timothy Henson, Naresh Thapar, David Kent | 2009-01-27 |
| 7390717 | Trench power MOSFET fabrication using inside/outside spacers | Jianjun Cao, David Kent, Robert Montgomery, Kyle Spring | 2008-06-24 |
| 7388275 | Electronic package with integrated capacitor | John D. Geissinger, Robert R. Kieschke | 2008-06-17 |
| 7368353 | Trench power MOSFET with reduced gate resistance | Jianjun Cao, Dave Kent, Robert Montgomery, Hugo Burke, Kyle Spring | 2008-05-06 |
| 7253510 | Ball grid array package construction with raised solder ball pads | — | 2007-08-07 |
| 7203608 | Impedane measurement of chip, package, and board power supply system using pseudo impulse response | Makoto Aikawa, Sang Hoo Dhong, Brian Flachs, Brad W. Michael, Yaping Zhou | 2007-04-10 |
| 7064412 | Electronic package with integrated capacitor | John D. Geissinger, Robert R. Kieschke | 2006-06-20 |
| 6876088 | Flex-based IC package construction employing a balanced lamination | — | 2005-04-05 |
| 6867121 | Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction | — | 2005-03-15 |
| 6153508 | Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same | — | 2000-11-28 |
| 6150071 | Fabrication process for flex circuit applications | William V. Dower, William V. Ballard | 2000-11-21 |
| 6140707 | Laminated integrated circuit package | Anthony R. Plepys | 2000-10-31 |
| 5753976 | Multi-layer circuit having a via matrix interlayer connection | — | 1998-05-19 |