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Method of manufacture for a cascode semiconductor device |
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Power semiconductor device with a double metal contact and related method |
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Power semiconductor device with a double metal contact |
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2016-04-19 |
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Packaging of electronic circuitry |
Florian Bieck |
2015-07-07 |
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Packaging of electronic circuitry |
Florian Bieck |
2015-04-07 |
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Semiconductor wafer with reduced thickness variation and method for fabricating same |
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2015-03-24 |
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Power semiconductor device including a double metal contact |
Hugo Burke, Philip Parsonage, Susan Johns, David Paul Jones |
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Peelable tape carrier |
— |
2012-05-08 |
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Wafer singulation process |
— |
2012-04-10 |
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Trench MOSFET with deposited oxide |
— |
2012-01-31 |
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Laser ablation to selectively thin wafers/die to lower device RDSON |
Hugo Burke |
2010-12-14 |
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Semiconductor package that includes stacked semiconductor die |
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2009-11-10 |
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Split electrode gate trench power device |
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2008-09-09 |
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Trench power MOSFET fabrication using inside/outside spacers |
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2008-06-24 |
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Method of making a trench MOSFET with deposited oxide |
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2008-05-13 |
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Trench power MOSFET with reduced gate resistance |
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