Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929018 | Semiconductor wafer and method for producing same | Carolinda Sukmadevi Asfhandy, Sven-Manfred Spiller | 2018-03-27 |
| 9245765 | Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer | — | 2016-01-26 |
| 9207276 | Method and apparatus for testing a semiconductor wafer | — | 2015-12-08 |
| 9076779 | Packaging of electronic circuitry | Robert Montgomery | 2015-07-07 |
| 9063407 | Photolithography mask method for a wafer, method for producing same, and photolithography method for wafer using the same | Sven-Manfred Spiller | 2015-06-23 |
| 9000512 | Packaging of electronic circuitry | Robert Montgomery | 2015-04-07 |
| 8114304 | Method for producing electronic components | Jürgen Leib | 2012-02-14 |
| 7825029 | Method for the production of structured layers on substrates | Jürgen Leib, Dietrich Mund | 2010-11-02 |
| 7821106 | Process for making contact with and housing integrated circuits | Jürgen Leib | 2010-10-26 |
| 7700957 | Process for making contact with and housing integrated circuits | Jürgen Leib | 2010-04-20 |
| 7285834 | Process for producing microelectromechanical components and a housed microelectromechanical component | Jürgen Leib | 2007-10-23 |
| 7160478 | Method for producing electronic componets | Jürgen Leib | 2007-01-09 |
| 7071521 | Process for producing microelectromechanical components and a housed microelectromechanical component | Jürgen Leib | 2006-07-04 |
| 6911392 | Process for making contact with and housing integrated circuits | Jürgen Leib | 2005-06-28 |
| 6894358 | Process for producing microelectromechanical components and a housed microelectromechanical component | Jürgen Leib | 2005-05-17 |