Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Wolfgang Lehnert, Verena Muhr, Edmund Riedl, Harry Sax | 2022-05-10 |
| 11127693 | Barrier for power metallization in semiconductor devices | Johann Gatterbauer, Katrin Albers, Joerg Busch, Klaus Goller, Marianne Kolitsch +3 more | 2021-09-21 |
| 8835319 | Protection layers for conductive pads and methods of formation thereof | Dirk Meinhold, Reimund Engl, Hans-Joerg Timme, Alfred Vater, Stephan Henneck +1 more | 2014-09-16 |