NL

Neo Yong Loo

Micron: 17 patents #998 of 6,345Top 20%
RR Round Rock Research: 1 patents #177 of 239Top 75%
Overall (All Time): #258,406 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8138617 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Eng Meow Koon +4 more 2012-03-20
8106488 Wafer level packaging Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia 2012-01-31
8008126 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2011-08-30
7679179 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2010-03-16
7675169 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Waf, Chan Min Yu, Eng Meow Koon +4 more 2010-03-09
7528477 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2009-05-05
7358154 Method for fabricating packaged die Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Eng Meow Koon +4 more 2008-04-15
7285850 Support elements for semiconductor devices with peripherally located bond pads Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Chua Swee Kwang 2007-10-23
7276387 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2007-10-02
7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Chia Yong Poo, Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Chan Min Yu 2007-06-05
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Chua Swee Kwang 2006-10-03
6949407 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2005-09-27
6894386 Apparatus and method for packaging circuits Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Eng Meow Koon +4 more 2005-05-17
6855572 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang +2 more 2005-02-15
6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages Chia Yong Poo, Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Chan Min Yu 2004-11-16
6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Chua Swee Kwang 2004-04-27
6611052 Wafer level stackable semiconductor package Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Chua Swee Kwang 2003-08-26
6582992 Stackable semiconductor package and wafer level fabrication method Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Chua Swee Kwang 2003-06-24