| 12388044 |
Al bonding wire |
Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more |
2025-08-12 |
| 12325901 |
AI wiring material |
Yuto KURIHARA, Ryo OISHI, Daizo Oda, Tetsuya OYAMADA, Yuya SUTO +1 more |
2025-06-10 |
| 12300658 |
Copper alloy bonding wire for semiconductor devices |
Daizo Oda, Takashi Yamada, Teruo Haibara, Tomohiro Uno |
2025-05-13 |
| 12290883 |
Bonding wire |
Daizo Oda, Ryo OISHI |
2025-05-06 |
| 12166006 |
Bonding wire for semiconductor devices |
Tomohiro Uno, Tetsuya OYAMADA, Daizo Oda |
2024-12-10 |
| 12132025 |
Bonding wire |
Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more |
2024-10-29 |
| 12090578 |
Al bonding wire |
Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more |
2024-09-17 |
| 11929343 |
Bonding wire for semiconductor devices |
Daizo Oda, Takashi Yamada, Teruo Haibara, Ryo OISHI |
2024-03-12 |
| 11721660 |
Bonding wire for semiconductor devices |
Daizo Oda, Takashi Yamada, Teruo Haibara, Ryo OISHI |
2023-08-08 |
| 11612966 |
Ag alloy bonding wire for semiconductor device |
Tetsuya OYAMADA, Tomohiro Uno, Daizo Oda, Takumi Ohkabe |
2023-03-28 |
| 11373934 |
Bonding wire for semiconductor device |
Daizo Oda, Takashi Yamada, Teruo Haibara, Tomohiro Uno |
2022-06-28 |
| 10950571 |
Bonding wire for semiconductor device |
Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada, Daizo Oda |
2021-03-16 |
| 10121758 |
Bonding wire for semiconductor device |
Daizo Oda, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more |
2018-11-06 |
| 10032741 |
Bonding wire for semiconductor device |
Daizo Oda, Takashi Yamada, Teruo Haibara, Ryo OISHI, Tomohiro Uno +1 more |
2018-07-24 |
| 9887172 |
Bonding wire for semiconductor device |
Daizo Oda, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more |
2018-02-06 |