Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10230458 | Optical die test interface with separate voltages for adjacent electrodes | Perry H. Pelley, Tab A. Stephens | 2019-03-12 |
| 10177052 | Defective die replacement in a die stack | Perry H. Pelley, Tim V. Pham | 2019-01-08 |
| 10002653 | Die stack address bus having a programmable width | Perry H. Pelley, Tim V. Pham | 2018-06-19 |
| 9810843 | Optical backplane mirror | Tab A. Stephens, Perry H. Pelley | 2017-11-07 |
| 9766409 | Optical redundancy | Perry H. Pelley, Tab A. Stephens | 2017-09-19 |
| 9480161 | Thin low profile strip dual in-line memory module | Perry H. Pelley, Tim V. Pham | 2016-10-25 |
| 9435952 | Integration of a MEMS beam with optical waveguide and deflection in two dimensions | Tab A. Stephens, Perry H. Pelley | 2016-09-06 |
| 9431380 | Microelectronic assembly having a heat spreader for a plurality of die | Tab A. Stephens, Perry H. Pelley | 2016-08-30 |
| 9318451 | Wirebond recess for stacked die | Tim V. Pham, Perry H. Pelley, Tab A. Stephens | 2016-04-19 |
| 9261556 | Optical wafer and die probe testing | Perry H. Pelley, Tab A. Stephens | 2016-02-16 |
| 9099475 | Techniques for reducing inductance in through-die vias of an electronic assembly | Kevin J. Hess, Perry H. Pelley, Tab A. Stephens | 2015-08-04 |
| 9094135 | Die stack with optical TSVs | Perry H. Pelley, Tab A. Stephens | 2015-07-28 |
| 9093429 | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices | Kevin J. Hess, Perry H. Pelley, Tab A. Stephens | 2015-07-28 |
| 9091820 | Communication system die stack | Tab A. Stephens, Perry H. Pelley | 2015-07-28 |
| 9087702 | Edge coupling of semiconductor dies | Tim V. Pham, Perry H. Pelley, Andrew C. Russell, James R. Guajardo | 2015-07-21 |
| 9082757 | Stacked semiconductor devices | Perry H. Pelley, Kevin J. Hess, Tab A. Stephens | 2015-07-14 |
| 9076664 | Stacked semiconductor die with continuous conductive vias | Perry H. Pelley, Kevin J. Hess | 2015-07-07 |
| 9070653 | Microelectronic assembly having a heat spreader for a plurality of die | Tab A. Stephens, Perry H. Pelley | 2015-06-30 |
| 8980734 | Gate security feature | Tab A. Stephens, Perry H. Pelley, Paul A. Grudowski | 2015-03-17 |
| 8957510 | Using an integrated circuit die configuration for package height reduction | Tim V. Pham, James R. Guajardo | 2015-02-17 |
| 8796855 | Semiconductor devices with nonconductive vias | Perry H. Pelley, Tab A. Stephens | 2014-08-05 |
| 8796822 | Stacked semiconductor devices | Perry H. Pelley, Kevin J. Hess | 2014-08-05 |
| 8680674 | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices | Kevin J. Hess, Perry H. Pelley, Tab A. Stephens | 2014-03-25 |
| 8501539 | Semiconductor device package | Kevin J. Hess | 2013-08-06 |
| 8004080 | Edge mounted integrated circuits with heat sink | Perry H. Pelley | 2011-08-23 |