Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7777330 | High bandwidth cache-to-processing unit communication in a multiple processor/cache system | Perry H. Pelley | 2010-08-17 |
| 5521428 | Flagless semiconductor device | Tom Hollingsworth | 1996-05-28 |
| 5517056 | Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same | Charles G. Bigler, Alan H. Woosley | 1996-05-14 |
| 5468999 | Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding | Paul T. Lin | 1995-11-21 |
| 5455200 | Method for making a lead-on-chip semiconductor device having peripheral bond pads | Charles G. Bigler, James J. Casto, David D. Afshar | 1995-10-03 |
| 5450283 | Thermally enhanced semiconductor device having exposed backside and method for making the same | Paul T. Lin | 1995-09-12 |
| 5381036 | Lead-on chip semiconductor device having peripheral bond pads | Charles G. Bigler, James J. Casto, David D. Afshar | 1995-01-10 |
| 5344600 | Method for encapsulating semiconductor devices with package bodies | Alan H. Woosley, Francis Primeaux | 1994-09-06 |
| 5311057 | Lead-on-chip semiconductor device and method for making the same | — | 1994-05-10 |
| 5294827 | Semiconductor device having thin package body and method for making the same | — | 1994-03-15 |
| 5273938 | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film | Paul T. Lin | 1993-12-28 |
| 5247423 | Stacking three dimensional leadless multi-chip module and method for making the same | Paul T. Lin | 1993-09-21 |
| 5239198 | Overmolded semiconductor device having solder ball and edge lead connective structure | Paul T. Lin | 1993-08-24 |
| 5220195 | Semiconductor device having a multilayer leadframe with full power and ground planes | Rolando J. Osorio | 1993-06-15 |
| 5216278 | Semiconductor device having a pad array carrier package | Paul T. Lin, Howard P. Wilson | 1993-06-01 |
| 5200362 | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film | Paul T. Lin, Sugio Uchida, Takehi Sato | 1993-04-06 |
| 5157480 | Semiconductor device having dual electrical contact sites | Paul T. Lin | 1992-10-20 |
| 5147821 | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation | James J. Casto, Bennett A. Joiner | 1992-09-15 |
| 5105259 | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation | James J. Casto, Bennett A. Joiner | 1992-04-14 |
| 5053357 | Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon | Paul T. Lin | 1991-10-01 |
| 5049526 | Method for fabricating semiconductor device including package | Paul T. Lin | 1991-09-17 |
| 5045914 | Plastic pad array electronic AC device | James J. Casto, Paul T. Lin | 1991-09-03 |
| 5041902 | Molded electronic package with compression structures | — | 1991-08-20 |
| 5029325 | TAB tape translator for use with semiconductor devices | Leo M. Higgins, III | 1991-07-02 |
| 5018005 | Thin, molded, surface mount electronic device | Paul T. Lin | 1991-05-21 |