| 11990520 |
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures |
Andre Brockmeier, Guenter Denifl, Ronny Kern, Matteo Piccin, Francisco Javier Santos Rodriguez |
2024-05-21 |
| 11610817 |
Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer |
Andreas Kitzler, John Cooper, Jakob Simon Dohr, Matic Krivec, Daniel Pieber |
2023-03-21 |
| 11515264 |
Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer |
Francisco Javier Santos Rodriguez, Alexander Breymesser, Erich Griebl, Matthias Kuenle, Andreas Moser +4 more |
2022-11-29 |
| 11211459 |
Semiconductor device and method of manufacturing a semiconductor device |
Andre Brockmeier, Guenter Denifl, Ronny Kern, Matteo Piccin, Francisco Javier Santos Rodriguez |
2021-12-28 |
| 10580753 |
Method for manufacturing semiconductor devices |
Martin Mischitz, Harald Huber, Claudia Sgiarovello, Caterina Travan, Andrew Christopher Graeme Wood |
2020-03-03 |
| 9698106 |
Metal deposition on substrates |
Kae-Horng Wang, Francisco Javier Santos Rodriguez, Guenther Koffler |
2017-07-04 |
| 9318446 |
Metal deposition on substrates |
Kae-Horng Wang, Francisco Javier Santos Rodriguez, Guenther Koffler |
2016-04-19 |
| 8841768 |
Chip package and a method for manufacturing a chip package |
Carsten von Koblinski, Ursula Meyer, Francisco Javier Santos Rodriguez, Alexander Breymesser, Andre Brockmeier |
2014-09-23 |
