Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8247030 | Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer | Kenji Suzuki, Atsushi Gomi | 2012-08-21 |
| 7884012 | Void-free copper filling of recessed features for semiconductor devices | Kenji Suzuki, Tadahiro Ishizaka, Jonathan Rullan | 2011-02-08 |
| 7846841 | Method for forming cobalt nitride cap layers | Tadahiro Ishizaka, Shigeru Mizuno | 2010-12-07 |
| 7799681 | Method for forming a ruthenium metal cap layer | Kenji Suzuki, Frank M. Cerio, Jr., Shigeru Mizuno, Yasushi Mizusawa, Tadahiro Ishizaka | 2010-09-21 |
| 7776740 | Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device | Kenji Suzuki, Jonathan Rullan | 2010-08-17 |
| 7718527 | Method for forming cobalt tungsten cap layers | Tadahiro Ishizaka, Shigeru Mizuno | 2010-05-18 |