Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2024-07-09 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2021-04-13 |
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Werner Kanert, Joachim Mahler +1 more | 2020-06-02 |
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Michael Bauer, Reimund Engl, Werner Kanert, Joachim Mahler +1 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2019-10-29 |
| 9941181 | Chip package and method of forming a chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Werner Kanert, Joachim Mahler +1 more | 2018-04-10 |