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Tensile dielectric films using UV curing |
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Low-K SiC copper diffusion barrier films |
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Low-k b-doped SiC copper diffusion barrier films |
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Low-k SiC copper diffusion barrier films |
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2009-08-11 |
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Boron-doped SIC copper diffusion barrier films |
Yongsik Yu, Atul Gupta, Karen Billington, William Crew, Thomas W. Mountsier |
2008-09-02 |
| 7282438 |
Low-k SiC copper diffusion barrier films |
Yongsik Yu, Karen Billington, Xingyuan Tang, Haiying Fu, William Crew |
2007-10-16 |
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Low-k B-doped SiC copper diffusion barrier films |
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2007-07-03 |
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Film for copper diffusion barrier |
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Film for copper diffusion barrier |
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2005-11-22 |