Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049524 | Interrelated entertainment devices for music and related information | Edgardo Antonio Mirand Beiro, Chase Schneider | 2021-06-29 |
| 5963795 | Method of assembling a heat sink assembly | Joseph Joroski | 1999-10-05 |
| 5900670 | Stackable heatsink structures for semiconductor devices | Joseph Joroski | 1999-05-04 |
| 5888847 | Technique for mounting a semiconductor die | Michael D. Rostoker | 1999-03-30 |
| 5885848 | Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom | Janet Kirkland | 1999-03-23 |
| 5869891 | Powdered metal heat sink with increased surface area | Michael D. Rostoker | 1999-02-09 |
| 5869778 | Powder metal heat sink for integrated circuit devices | — | 1999-02-09 |
| 5814536 | Method of manufacturing powdered metal heat sinks having increased surface area | Michael D. Rostoker | 1998-09-29 |
| 5789813 | Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom | Janet Kirkland | 1998-08-04 |
| 5780928 | Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices | Michael D. Rostoker, Nicholas F. Pasch | 1998-07-14 |
| 5773886 | System having stackable heat sink structures | Michael D. Rostoker, Joseph Joroski | 1998-06-30 |
| 5744171 | System for fabricating conductive epoxy grid array semiconductor packages | — | 1998-04-28 |
| 5729894 | Method of assembling ball bump grid array semiconductor packages | Michael D. Rostoker, Edwin M. Fulcher | 1998-03-24 |
| 5728599 | Printable superconductive leadframes for semiconductor device assembly | Michael D. Rostoker, Chok J. Chia | 1998-03-17 |
| 5693981 | Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system | Joseph Joroski | 1997-12-02 |
| 5654587 | Stackable heatsink structure for semiconductor devices | Joseph Joroski | 1997-08-05 |
| 5644143 | Method for protecting a semiconductor device with a superconductive line | Michael D. Rostoker, Nicholas F. Pasch, Abraham Yee, William C. Schneider | 1997-07-01 |
| 5639696 | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array | Dexin Liang | 1997-06-17 |
| 5610442 | Semiconductor device package fabrication method and apparatus | Robert T. Trabucco | 1997-03-11 |
| 5593918 | Techniques for forming superconductive lines | Michael D. Rostoker, Nicholas F. Pasch, Abraham Yee, William C. Schneider | 1997-01-14 |
| 5572069 | Conductive epoxy grid array semiconductor packages | — | 1996-11-05 |
| 5552634 | Method and apparatus for dissipating heat in an electronic device | — | 1996-09-03 |
| 5514327 | Powder metal heat sink for integrated circuit devices | — | 1996-05-07 |
| 5504374 | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material | Susan A. Oliver | 1996-04-02 |
| 5410806 | Method for fabricating conductive epoxy grid array semiconductors packages | — | 1995-05-02 |