Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5504374 | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material | Mark R. Schneider | 1996-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5504374 | Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material | Mark R. Schneider | 1996-04-02 |